Package and light emitting device

ABSTRACT

A package includes a first electrode and a second electrode that are located at a bottom portion of a bottomed recess, and a first resin securing the first electrode and the second electrode in place and forming a part of the bottomed recess. The first electrode has a first outer lead having a first indentation at a tip in a plan view. The second electrode has a second outer lead having a second indentation at a tip in a plan view. The first resin has at least a portion between the first electrode and the second electrode located at the bottom portion of the bottomed recess, wall portions structuring lateral walls of the bottomed recess, and flange portions having the same thickness as a thickness of the first outer lead and different outward widths from the wall portions on both sides of the first outer lead in a plan view.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a divisional application of the U.S. patentapplication Ser. No. 15/371,214 filed Dec. 7, 2016, which claimspriority under 35 U.S.C. § 119 to Japanese Patent Application No.2015-240196, filed on Dec. 9, 2015. The contents of these applicationsare incorporated herein by reference in their entirety.

BACKGROUND Technical Field

The present invention relates to a package and a light emitting device.

Discussion of the Background

Patent Document 1 which is Japanese Unexamined Patent ApplicationPublication 2010-186896 and Patent Document 2 which is JapaneseUnexamined Patent Application Publication 2013-051296 disclose themethods for manufacturing packages described below. A lead frame isclamped by molding dies. The lead frame is placed on the bottom face ofa bottomed recess, and a molding resin is injected into the dies fromthe back face side which is the opposite side of the open end of therecess. The molding resin is insert-molded, and after solidifying themolding resin, the leads are bent to produce a package.

Patent Document 3 which is Japanese Unexamined Patent ApplicationPublication 2013-077813 discloses a package produced by integrallymolding a lead frame and a resin, and has a recess at the upper facewhere a light emitting element is installed. At the edges of the innerleads embedded in the molded resin, bent terminal portions are providedwhich are bent upwardly from the bottom of the inner leads which make upthe lead frame. The lead frame is bent before being set in the moldingdies.

SUMMARY

According to a first aspect of the present disclosure, a packageincludes: a first electrode located at a bottom portion of a bottomedrecess and having a first outer lead which has a first indentation at atip in a plan view; a second electrode located at the bottom portion ofthe bottomed recess and having a second outer lead which has a secondindentation at a tip in a plan view; and a first resin securing thefirst electrode and the second electrode in place and forming a part ofthe bottomed recess. The first resin has at least a portion between thefirst electrode and the second electrode located at the bottom portionof the bottomed recess, wall portions structuring lateral walls of thebottomed recess, and flange portions having the same thickness as athickness of the first outer lead and different outward widths from thewall portions on both sides of the first outer lead in a plan view.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the invention and many of the attendantadvantages thereof will be readily obtained as the same becomes betterunderstood by reference to the following detailed description whenconsidered in connection with the accompanying drawings.

FIG. 1 is a schematic diagram of the package according to oneembodiment, and is a perspective view of the whole package.

FIG. 2 is a schematic diagram of the package according to theembodiment, and is a top view of the package.

FIG. 3 is a schematic diagram of the package according to theembodiment, and is a sectional view along line indicated in FIG. 2.

FIG. 4 is a schematic diagram of the package according to theembodiment, and is a bottom view of the package.

FIG. 5 is a schematic diagram of a manufacturing step of the packageaccording to the embodiment, and is a plan view of the lead frame.

FIG. 6 is a schematic diagram of a manufacturing step of the packageaccording to the embodiment, and is a sectional view along line VI-VIindicated in FIG. 5.

FIG. 7 is a schematic diagram of a manufacturing step of the packageaccording to the embodiment, and is a sectional view of the layout ofthe lead frame and the molding dies at the position corresponding toline X-X indicated in FIG. 9.

FIG. 8 is a schematic diagram of a manufacturing step of the packageaccording to the embodiment, and is a sectional view of the layout ofthe lead frame and the molding dies at the position corresponding toline XI-XI indicated in FIG. 9.

FIG. 9 is a schematic diagram of a manufacturing step of the packageaccording to the embodiment, and is a top view of the lead frame.

FIG. 10 is a schematic diagram of a manufacturing step of the packageaccording to the embodiment, and is a sectional view along line X-Xindicated in FIG. 9 after injecting the first resin.

FIG. 11 is a schematic diagram of a manufacturing step of the packageaccording to the embodiment, and is a sectional view along line XI-XIindicated in FIG. 9 after injecting the first resin.

FIG. 12 is a schematic diagram of a manufacturing step of the packageaccording to the embodiment, and is a plan view of the cured orsolidified package.

FIG. 13 is a schematic diagram of a manufacturing step of the packageaccording to the embodiment, and is a plan view of the package aftercutting out a portion of the border between the first electrode and thefirst connection portion.

FIG. 14 is a schematic diagram of a manufacturing step of the packageaccording to the embodiment, and is a plan view of the package afterelectroplating the first electrode.

FIG. 15 is a schematic diagram of a manufacturing step of the packageaccording to the embodiment, and is a plan view of the package aftermounting a light emitting element on the first electrode.

FIG. 16 is a schematic diagram of a manufacturing step of the packageaccording to the embodiment, and is a plan view of the package aftercutting out the remaining portion of the border between the firstelectrode and the first connection portion.

FIG. 17 is a schematic diagram of the light emitting device according tothe embodiment, and is a perspective view of the whole light emittingdevice.

DESCRIPTION OF THE EMBODIMENTS

The embodiments will now be described with reference to the accompanyingdrawings, wherein like reference numerals designate corresponding oridentical elements throughout the various drawings.

The method for manufacturing a package, the method for manufacturing alight emitting device, the package, and the light emitting device shownas an exemplary embodiment will be explained below. Since the drawingsreferenced in the explanation are schematic representations of theembodiment, the scaling, spacing, and relative positions of the membersmight be exaggerated, or some members might be omitted. In theexplanation below, the same designations and reference numerals aregiven to the same members or those of similar quality, for which thedetailed explanation are omitted when appropriate.

Unless otherwise noted, the direction perpendicular to the wall portionsis referred to as the “width,” and the direction in parallel to the wallportions is referred to as the “length.”

Structure of Package 100

An explanation will follow by using the drawings. FIG. 1 is a schematicdiagram of the package according to one embodiment, and is a perspectiveview of the whole package. FIG. 2 is a schematic diagram of the packageaccording to the embodiment, and is a top view of the package. FIG. 3 isa schematic diagram of the package according to the embodiment, and is asectional view along line III-III indicated in FIG. 2. FIG. 4 is aschematic diagram of the package according to the embodiment, and is abottom view of the package.

The overall shape of the package 100 is substantially a rectangularparallelepiped, and a bottomed recess 110 is formed therein. The package100 includes a first electrode 10, a second electrode 20, and a firstresin 30.

The first electrode 10 includes a first outer lead portion 11 and afirst inner lead portion 12.

The first outer lead portion 11 refers to the lead portion located onthe outer side of the wall portion 31 of the first resin 30. The firstouter lead portion 11 has a first indentation 711 at the tip, and formsa shape which extends perpendicularly to the wall portions 31. Theshape, however, is not limited to this, and may have an additionalcutout, indentation, or hole.

The first inner lead portion 12 refers to the lead portion located onthe inner side of, and under the wall portion 31 of the first resin 30.The shape of the first inner lead portion 12 is substantiallyrectangular in a plan view. The shape, however, is not limited to this,and may have a cutout, an indentation, or a hole. In a back view of thepackage 100, the width W1 of the first outer lead portion 11 exposedfrom the first resin 30 in this embodiment is smaller than the width W2of the first inner lead portion 12 exposed from the first resin 30. Thefirst inner lead 12 is located at the bottom of the bottomed recess 110.

The second electrode 20 includes a second outer lead portion 21 and asecond inner lead portion 22. The second outer lead portion 21 refers tothe lead portion located on the outer side of the wall portion 31 of thefirst resin 30. The second outer lead 21 includes a second indentation721 at the tip, and forms a shape which extends perpendicularly to thewall portions 31. The shape, however, is not limited to this, and mayinclude an additional cutout, indentation, or hole.

The second inner lead portion 22 refers to the lead portion located onthe inner side of, and under the wall portion 31 of the first resin 30.The shape of the second inner lead portion 22 is substantiallyrectangular in a plan view. The shape, however, is not limited to this,and may have a cutout, an indentation, or a hole. In a back view of thepackage 100, the width W1 of the second outer lead portion 21 exposedfrom the first resin 30 in this embodiment is smaller than the width W2of the second inner lead portion 22 exposed from the first resin 30. Thesecond inner lead 12 is located at the bottom of the bottomed recess110.

The first electrode 10 and the second electrode 20 are formed to beoutwardly exposed from the first resin 30 at the bottom face 105 of thepackage 100. The outer side of the bottom face 105 of the package 100 isthe face to be mounted on an external circuit board. The first electrode10 and the second electrode 20 are spaced apart, and the first resin 30interposed between the first electrode 10 and the second electrode 20forms a part of the bottom portion of the bottomed recess 110. When usedas a light emitting device 1, the first electrode 10 and the secondelectrode 20 correspond to an anode and a cathode, respectively, meaningthat the polarity differs between the two.

The lengths, widths, thicknesses of the first electrode 10 and thesecond electrode 20 are not particularly limited, and can suitably beselected in accordance with the objectives and applications. The upperface, the lower face, the lateral face of the first indentation 711, andone of the end faces contiguous with the first indentation 711 of thefirst outer lead portion 11 are covered by a metal, while the other endface contiguous with the first indentation 711 is not covered by ametal. The upper face, the lower face, the lateral face of the secondindentation 721, and one of the end faces contiguous with the secondindentation 721 of the second outer lead portion 21 are covered by ametal, while the other end face contiguous with the second indentation721 is not covered by a metal. Covering the first outer lead portion 11and the second outer lead portion 21 with a metal in this way canimprove the mountability of the light emitting device 1 when mountingthe light emitting device 1 using solder or the like. Solder has pooradhesion with an unplated portion of the lead frame, but has goodadhesion with a plated portion. Thus, increasing the plated metal layerareas allows solder to creep up the metal layers to improvemountability.

For the materials used for the first electrode 10 and the secondelectrode 20, for example, copper, iron, copper alloys, and ferroalloysare preferable. The outermost surface is preferably covered with a metalmaterial having a high optical reflectance, such as silver, aluminum,gold, or the like. The thickness of the metal covering the firstelectrode 10 is not particularly limited, but is preferably a thicknessthat allows for efficient optical reflection in a range between about0.1 and about 0.3 μm, more preferably in a range between about 1 andabout 20 μm. The metal is preferably formed as a uniform film or layer.The metal layer may be of a single layer or multiple layers of two ormore.

The first resin 30 includes wall portions 31 and flange portions 32. Thefirst resin 30 secures the first electrode 10 and the second electrode20 in place. The wall portions 31 constitute the lateral walls of thebottomed recess 110. The flange portions 32 have substantially the samethickness as that of the first outer lead portion 11, and the flangeportions located on both sides of the first outer lead portion 11 in aplan view have different widths outwardly from the wall portion 31. Thewall portions 31 are formed on the first electrode 10 and the secondelectrode 20, the four sides forming a rectangle. The wall portions 31are formed so that two opposing sides of the rectangle shape interposethe first electrode 10, and interpose the second electrode 20. Thisallows the wall portions 31 to secure the first electrode 10 and thesecond electrode 20 in place. The first resin 30 is also present betweenthe first electrode 10 and the second electrode 20 located at the bottomportion of the bottomed recess 110. The first resin 30 at the bottomportion of the bottomed recess 110 having “substantially the samethickness” as that of the first electrode 10 here means that thethickness of the first resin 30 is 0.8 to 1.0 times the thickness of thefirst electrode 10. It can physically be given the same thickness, i.e.1.0 times the thickness, but the first resin 30 can be thinner than thefirst electrode 10. For example, the thickness of the first resin 30between the first electrode 10 and the second electrode 20 can be madethinner than the thickness of the first electrode 10. This can moreeffectively prevent shorting between the first electrode 10 and thesecond electrode 20. Moreover, the first resin 30 can be inwardlydepressed relative to the first electrode 10 and the second electrode 20in a back view.

The first resin 30 is expressed as the first resin 30 regardless ofwhether it is before or after molding, curing or solidifying. In thecase where an epoxy resin is used for the first resin 30, for example,the first resin 30 has no shape or in liquid state prior to molding, buthas a prescribed shape following molding.

In a plan view, the package 100 has a first outer lateral face 101, asecond outer lateral face 102 contiguous with the first outer lateralface 101, a third outer lateral face 103 contiguous with the secondouter lateral face 102 and opposing the first outer lateral face 101,and a fourth outer lateral face 104 contiguous with the first outerlateral face 101 and the third outer lateral face 103. The first outerlead 11 is located at the first outer lateral face 101, and the secondouter lead 21 is located at the third outer lateral face 103.

The wall portions 31 are formed to structure a rectangular recess in aplan view, and the shape thereof is a rectangular annulus. The height,length, and width of the wall portions 31 are not particularly limited,and can suitably be selected in accordance with the objectives andapplications.

In a plan view, the first resin 30 has flange portions 32. The flangeportions 32 project laterally from the wall portions 31. The flangeportions 32 are formed next to the first outer lead portion 11 locatedat the first outer lateral face 101, and next to the second outer leadportion 21 located at the third outer lateral face 103. The width of theflange portion 32 next to the first outer lead portion 11 on one side issubstantially the same as width of the first outer lead portion 11, andthe width of the flange portion 32 on the other side is smaller than thewidth of the first outer lead portion 11. The widths of the flangeportions 32 next to the second outer lead portion 12 on both sides aresubstantially the same as the width of the second outer lead portion 21.Forming them in this way can provide a cathode mark or an anode mark.The flange portions 32 are located on both sides of the second outerlead portion 21 at the third outer lateral face 103, but it suffices tobe provided at least on one side. The flange portions 32 are alsoprovided at the second outer lateral face 102 and the fourth outerlateral face 104 here, but can be provided only at one of the secondouter lateral face 102 and the fourth outer lateral face 104. The widthof the flange portion 32 located at the second outer lateral face 102and the width of the flange portion 32 located at the fourth outerlateral face 104 are preferably the same. This provides a balancedlayout for stability. Giving the flange portions 32 the same width makesthe stress applied to the flange portions 32 uniform. The width of thesmaller width flange next to the first outer lead 11 is preferably thesame as the width of the flange portion 32 located at the second outerlateral face 102 because this can make the stress applied to the flangeportions 32 uniform. Moreover, it is preferable to make the thickness ofthe first electrode 10, the thicknesses of the flange portions 32 onboth sides of the first outer lead portion 11, and the thickness of theflange portion 32 located at the second outer lateral face 102substantially equal. This can also make the stress applied to the flangeportions 32 uniform.

The second outer lateral face 102 and the fourth outer lateral face 104are preferably composed only of the first resin 30. In other words,neither the first electrode 10 nor the second electrode 20 are exposed.This can reduce the penetration of moisture or the like into the firstresin 30.

The first outer lead portion 11, the second outer lead portion 21, andthe flange portions 32 may be formed so that they are coplanar, or thefirst outer lead portion 11 and the second outer lead portion 21 may beoutwardly projected. Because this enables mounting with the first outerlead portion 11 and the second outer lead portion 21, which improvesmounting stability. In this embodiment, the injection port 555 for thefirst resin 30 is provided on one side of the first electrode 10 whichwill be cut and removed after injecting, and curing or solidifying thefirst resin 30. When that portion is cut and removed after the resin 30has been injected, and cured or solidified, there will only remain oneflange portion 32 next to the first electrode 10. The first resin 30includes the flange portions 32 at four faces of the wall portions 31,but the number of the flange portions can be any as long as it is one ormore. The outer lateral faces of the wall portions 31 having no flangeportion will be planar from the upper face to the bottom face.

The widths of the flange portions 32 located at the first outer lateralface 101 are preferably the same as, or shorter than the width of thewall portion 31. The width of the flange portions 32 located at thesecond outer lateral face 102, the third outer lateral face 103, and thefourth outer lateral face 104 is preferably shorter than the width ofthe wall portions 31. The widths of the flange portions 32 depend on thesize of the package 100, but is preferably 1 mm or smaller, morepreferably 0.5 mm or smaller, even more preferably 0.1 mm or smaller.

Examples of the materials for the first resin 30 include thermoplasticresins and thermosetting resins.

In the case of thermoplastic resins, for example, polyphthalamideresins, liquid crystal polymers, polybutylene terephthalate (PBT),unsaturated polyester, and polyamide resins can be used.

In the case of thermosetting resins, for example, epoxy resins, modifiedepoxy resins, silicone resins, and modified silicone resins can be used.

It is preferable for the first resin 30 to contain a light reflectingmaterial in order for the inner faces of the wall portions 31 of thefirst resin 30 to efficiently reflect light. Examples of lightreflecting materials include white fillers having high reflectance, suchas titanium oxide, glass filler, silica, alumina, and zinc oxide. Thevisible light reflectance of 70% or higher, or 80% or higher ispreferable. Particularly, reflectance of 70% or higher, or 80% or higherin the wavelength range of the light emitted by the light emittingelement is preferable. The content of titanium oxide or the like is in arange between 5 wt % and 50 wt %, preferably, without limitation, in arange of 10 wt % and 30 wt %.

As described above, the package 100 can have a reduced thickness becausethe injection port 555 for the first resin 30 is provided in the area tobe cut and removed after curing or solidifying the first resin 30.Particularly, the thickness of the back face of the package 100, i.e.,the thicknesses of the flange portions 32 of the first resin 30, thefirst electrode 10, the second electrode 20, and the like can be reducedas compared to conventional packages. This can improve the heatdissipation properties during the operation of the light emittingelement mounted on the package 100.

Method for Manufacturing Package 100 and Light Emitting Device 1

The method for manufacturing the package 100 and light emitting device 1will be explained next with reference to FIG. 5 to FIG. 17. FIG. 5 is aplan view of the lead frame. FIG. 6 is a sectional view along line VI-VIindicated in FIG. 5. FIG. 7 is a schematic sectional view of the layoutof the lead frame and the molding dies at the position corresponding toline X-X indicated in FIG. 9. FIG. 8 is schematic sectional view of thelayout of the lead frame and the molding dies at the positioncorresponding to line XI-XI indicated in FIG. 9. FIG. 9 is a top view ofthe lead frame. This lead frame is clamped by the upper die and thelower die, but for explanation purposes, the lead frame is shown throughthe dies. FIG. 10 is a sectional view along line X-X indicated in FIG. 9after injecting the first resin. FIG. 11 is a sectional view along lineXI-XI indicated in FIG. 9 after injecting the first resin. FIG. 12 is aschematic plan view of the cured or solidified package. FIG. 13 is aschematic plan view of the package after cutting a portion of the borderbetween the first electrode and the first connection portion. FIG. 14 isa schematic plan view of the package after electroplating the firstelectrode. FIG. 15 is a schematic plan view of the package in which alight emitting element has been mounted on the first electrode. FIG. 16is a schematic plan view of the package after cutting the remainingportion of the border between the first electrode and the firstconnection portion. FIG. 17 is a schematic diagram of the light emittingdevice according to the embodiment, and is a perspective view of thewhole light emitting device.

The method for manufacturing the package according to this embodimenthas the steps (1) to (6) described below.

(1) Preparing Lead Frame

In the step of preparing a lead frame, a lead frame 5 is prepared whichhas a first electrode 10 and a second electrode 20 which differs fromthe first electrode 10 in the package forming area 600, a first throughhole 710 on the first electrode 10 side at the position which straddlesthe outer edge of the package forming area 600, and a second throughhole 720 on the second electrode 20 side.

Alternatively, a lead frame 5 is prepared which has a frame 7, a firstelectrode 10, a second electrode 20, a first connection portion 8connecting the frame 7 and the first electrode 10, and a secondconnection portion 9 connecting the frame 7 and the second electrode 20,wherein a first through hole 710 is provided between the first electrode10 and the first connection portion 8, and a second through hole 720 isprovided between the second electrode 20 and the second connectionportion 9. The flat sheet-form lead frame 5 has openings.

A gap is provided between the first electrode 10 and the secondelectrode 20. This gap is preferably in a width that roughly equals tothe thickness of the lead frame 5 or wider. The first electrode 10 andthe second electrode 20 each has a substantially quadrangle portion withrounded corners, and a portion that is narrower than the substantiallyquadrangle portion. The lead frame 5 has the first connection portion 8and the second connection portion 9, which have about the same widths asthose of the narrow portions of the first electrode 10 and the secondelectrode 20, and are connected thereto on the outside of the packageforming area 600. The openings in the lead frame 5 can be formed bypunching, cutting, etching, or the like. The package forming area 600herein defines the outer perimeter of the area which will become thebottom face 105 of the molded package 100 when separated from the leadframe 5. Being separated from the lead frame 5 refers to the separationof the first electrode 10 and the second electrode 20 from the frame 7,the first connection portion 8 and the second connection portion 9. Thefirst electrode 10 in the lead frame S means the portion correspondingto the first electrode 10 after molding, and is in a state prior toseparation into an individual piece. Similarly, the second electrode 20in the lead frame 5 means the portion corresponding to the secondelectrode 20 after molding, and is in a state prior to separation intoan individual piece. For simplification purposes, the lead frame 5 willbe explained as including a single package forming area 600, but thenumber may be plural.

The lead frame 5, which is a sheet material, has openings of prescribedshapes in the surrounding of the first electrode 10 and the secondelectrode 20, and the opposing portions of the first electrode 10 andthe second electrode 20 are spaced apart. The lead frame 5 has a frame 7that surrounds the first electrode 10 and the second electrode 20.

The portion of the first electrode 10, which corresponds to the firstouter lead portion 11 after molding, is connected to the frame 7 by thefirst connection portion 8. The lead frame 5 has a first opening 6 a anda second opening 6 b as gap portions provided on both sides of the firstelectrode 10 or the first connection portion 8. As described later, inthis embodiment, the first resin 30 is injected through the firstopening 6 a.

The portion of the second electrode 20, which corresponds to the secondouter lead portion 21 after molding, is connected to the frame 7 by thesecond connection portion 9. The lead frame 5 has a third opening 6 cand a fourth opening 6 d as gap portions provided on both sides of thesecond electrode 20 or the second connection portion 9.

(2) Placing the Lead Frame in Dies

In the step of placing the lead frame in the dies, the first electrode10 and the second electrode 20 of the lead frame 5 are clamped by theupper die 550 and the lower die 560 of the top/bottom split molding dies500. For explanation purposes, the lower face of the lead frame 5 andthe lower die 560 are shown apart, but the lead frame 5 is secured onthe lower die 560. The lower die 560 has projected portions, and theprojected portions are fitted into the second opening 6 b, the thirdopening 6 c, and the fourth opening 6 d to secure the lead frame 5 inplace. The projected portions formed on the lower die 560 come intocontact with the upper die 550 to restrict the flow of the first resin30. Since the second opening 6 b, the third opening 6 c, and the fourthopening 6 d are not filled with the first resin 30, the openings aremaintained. Thus, cutting and removal of the flange portions 32 can beomitted.

The upper die 550 of the molding dies 500 has a recess 501 thatcorresponds to the wall portions 31 of the first resin 30 to be formedon the first electrode 10 and the second electrode 20. The resin 30 isinjected into the recess 501 formed in the upper die 550. The recess 501formed in the upper die 550 is continuous and rectangular-ring-shaped. Athrough hole which serves as the injection port 555 is created in theupper die 550 at a different location from the recess 501, which is onthe outside of the recess 501 in a plan view. The lead frame is clampedfirmly enough to prevent the first resin 30 from penetrating between thegaps between the lead frame 5 and the upper die 550 and between the leadframe 5 and the lower die 560. If the first resin 30 were to penetratethe gaps between the lead frame 5 and the upper die 550 and between thelead frame 5 and the lower die 560, allowing the first resin 30 to beadhered on the surface of the lead frame 5 in the area where a lightemitting element will be mounted, a step of removing burrs would berequired.

(3) Injecting the First Resin into Dies and Molding

The upper die 550 of the molding dies 500 has an injection port on theoutside of the package forming area 600. The first opening 6 a of thelead frame 5 is provided in the portion corresponding to the injectionport 555 of the upper die 550. The injection port 555 is formed on theframe 7 side on one side of the first electrode 10. Here, a lightreflecting material is premixed in the first resin 30 to be injectedthrough the injection port 555.

In this step, the first resin 30 is injected through the injection port555 located next to first electrode 10 and the first outer lead portion11 in a plan view into the molding dies 500 in which the lead frame 5 isclamped by the upper die 550 and the lower die 560.

The lead frame 5 which has been prepared has the first opening 6 a nextto the first electrode 10 or the first connection portion 8, and thefirst resin 30 is injected through the first opening 6 a. The firstresin 30 injected through the injection port 555 passes through thefirst opening 6 a of the lead frame 5 and is injected into the recess501 of the upper die 550. Here, an explanation is given as being oneinjection port 555, but multiple ports can be provided in the upper die550. Moreover, the injection port 550 is provided in the upper die 550,but the injection port can alternatively be provided in the lower die560 to inject the first resin 30 from the lower die 560 side.

The step of injecting the first resin 30 can be accomplished byutilizing any known method, such as injection molding, transfer molding,extruding, or the like.

In this embodiment, the first resin 30 is assumed to be a thermosettingresin, such as an epoxy resin, for example. In this case, the step ofinjecting the first resin 30 is assumed to be performed by transfermolding. In advance of transfer molding, a thermosetting resin (tablets)in pellets of a prescribed size are placed in a prescribed containerconnected to the upper die 550. The steps (2) and (3) described above inthe case of transfer molding will be briefly explained below.

In the case of transfer molding, in the step (2) described above, thelead frame 5 is secured on the heated lower die 560, and clamped betweenthe similarly heated upper die 550 and the lower die 560. The dies 500have the recess 501 which corresponds to the wall portions 31 to beformed on the first electrode 10 and the second electrode 20, and thefirst resin 30 will be injected into the recess 501. In the step (3)described above, by applying pressure to the prescribed containerconnected to the upper die 550 using a piston, for example, the moltenthermosetting resin as the first resin 30 is injected to the recess 501of the upper die 550 from the container through the injection port 555.The thermosetting resin which is the first resin 30 is then heated. Thecured thermosetting resin by way of heating becomes the first resin 30.Curing can be performed in one stage, but is preferably performed in twostages where it is semi-cured at a slightly low temperature followed byfully curing at a high temperature. Two-stage curing can produce asturdier first resin 30.

In the case where the first resin 30 is a thermoplastic resin, forexample, a polyphthalamide resin, injection molding can be used. In thiscase, the thermoplastic resin to be injected in the dies 500 is meltedat a high temperature, injected into the low temperature dies to besolidified by cooling.

The first resin 30 injected as described above is cured or solidified toform the wall portions 31 corresponding to the recess 501 of the upperdie 550 of the top/bottom split dies 500.

(4) Cutting out a Portion of the Border between the First Electrode andthe First Connection Portion

After molding the first resin 30, a portion of the lead frame 5 whichruns through the first through hole 710 or the second through hole 720is cut out at the outer edge of the package forming area 600.

Alternatively, after molding the first resin 30, a portion of the borderbetween the first electrode 10 and the first connection portion 8running through the first through hole 710 is cut out. The first throughhole 710 is located to straddle the first electrode 10 and the firstconnection portion 8. In other words, both the first electrode 10 andthe first connection portion 8 are present on both sides of the throughhole 710. The border between the first electrode 10 and the firstconnection portion 8 on one side is cut out. Since the first resin 30 isabsent in the first through hole 710, all that is required is to cut thefirst connection portion 8. After severing the first electrode 10 fromthe first connection portion 8, the portion of the lead frame 5 locatedon the package 100 side becomes the first electrode 10, and the portionon the other side becomes the first connection portion 8. The firstthrough hole 710 straddles the first electrode 10 and the firstconnection portion 8. Preforming the first through hole 710 in the leadframe 5 can reduce the area to be cut out in the cutting step. A portionof the first outer lead portion 11 becomes a part of the through hole710.

The second electrode 20, the second connection portion 9, and the secondthrough hole 720 can be cut in a similar manner to that applied to thefirst electrode 10, the first connection portion 8, and the firstthrough hole 710, but the second electrode 20, the second connectionportion 9 and the through hole 720 can be cut all at once.

Using a cutter or dicer, the portion of the border between the firstelectrode 10 and the first connection portion 8 can be cut all at once,or in several cutting operations.

The cut face of first electrode 10 severed from the first connectionportion 8 is preferably flat, but may have irregularities. The cut faceis preferably perpendicular to the plane of the first electrode 10, butmay be oblique. The cut face will be covered with a metal in thesubsequent plating step.

(5) Electroplating the First Electrode and the Second Electrode

The lead frame 5 having the first resin 30 molded thereon is removedfrom the molding dies 500, and the lead frame 5 is electricallyconnected for electroplating the first electrode 10 and the secondelectrode 20. Only the portions of the lead frame 5 that are exposedfrom the first resin 30 will be covered with a metal. Accordingly, theupper face and lower face of the first outer lead portion 11, thelateral face of the first indentation 711, the cut face, the upper faceand the lower face of the first inner lead portion 12, the upper faceand the lower face of the second outer lead portion 21, the lateral faceof the second indentation 721, and the upper face and the lower face ofthe second inner lead portion 22 will be plated. The plating can be notonly one layer, but also multiple layers having two or more layers.Multiple layers can be achieved by repeating the plating step.

(6) Cutting out the Remaining Border between the First Electrode and theFirst Connection Portion

The first electrode 10, particularly the remaining portion of the borderbetween the first outer lead portion 11 and the first connection portion8 running through the first through hole 710 is cut out. Similarly, thesecond electrode, particularly the remaining portion of the borderbetween the second outer lead portion 21 and the second connectionportion 9 running through the second through hole 720 is cut out.

Alternatively, at the outer edges of the package forming area 600, theremaining portion of the lead frame 5 running through the first throughhole 710, and the remaining portion of the lead frame 5 running throughthe second through hole 720 are cut out.

This step of cutting the remaining portions is preferably performedconcurrently with the step of cutting and removing the injection mark155 of the injection port 555. Cutting the injection mark and theremaining portions at the same time can make the end of the firstelectrode 10 coplanar with the flange portion 32. This provides theflange portion 32 with a different width from the width of the flangeportion 32 formed in the second opening 6 b. The flange portion 32provided with a different width can serve as an anode mark or a cathodemark.

The upper face and the lower face of the first outer lead portion 11,the first indentation 711, and the lateral face at the end on one sideare plated, while the lateral face corresponding to the remainingportion is not plated.

The injection mark 155 of the injection port 555 on the first resin 30is cut and removed.

The injection mark 155 of the injection port 555 on the first resin 30is cut and removed after curing or solidifying the first resin 30. Thepackage 100 is separated by cutting the first resin 30 and the leadframe 5. The shorter sides of the rectangular package forming area 600on the right and the left have the lead frame 5 and the first resin 30.The area of the lead frame 5 to be severed can be reduced by providingcircular, elliptical, polygonal, or roughly polygonal cutouts or holesin the portions of the lead frame 5 which will be severed.

In this embodiment, the leads located at the shorter sides of thepackage forming area 600 are cut at the time of separating the package100 from the lead frame 5, and the first resin 30 is held by the frame7. Thus, the package 100 can be separated by applying a prescribedamount of pressure from the frame 7 to the package 100. Subsequent tothe injection, and curing or solidification of the first resin 30, theportion corresponding to the recess 501 of the upper die 550 would havebeen filled with the first resin 30, and thus, the ends of the firstresin 30 would also be cut at the same time.

The injection mark 155 on the first resin 30 next to the first electrode10 can be cut and removed. This leaves no injection mark 155 on thesurface of the package 100. The timing of the cutting may be before orafter mounting a light emitting element 200. The package 100 can beproduced by the steps (1) to (6) described above.

In conventional methods, resin was injected from the back face side ofthe package. In the method for manufacturing a package according to thisembodiment, resin is injected from the location which is on the outsideof the package forming area 600 and next to the first electrode 10,followed by cutting and removing the injection mark 155. Thus, thethickness of the package can be reduced.

Moreover, the method for manufacturing a package according to thisembodiment does not require the step of bending leads as in the case ofconventional package manufacturing methods, thereby reducing time andlabor for the bending process.

In conventional manufacturing methods, in the case of preparing asheet-form lead frame having multiple package forming areas arranged ina two dimensional array, for example, the prescribed spacing betweenthem accounted for bending of the leads. In contrast, since the packagemanufacturing method according to this embodiment does not require thelead bending step, the need for securing the lead lengths that accountfor bending is eliminated. In other words, the spaces between thepackages can be reduced by that much, which increases the number ofpackages resulting from the same sheet-form lead frame, thereby allowingfor effective utilization of the material used for the lead frame.

Structure of the Light Emitting Device 1

The structure of the light emitting device 1 will be explained next withreference to FIG. 17. FIG. 17 is a schematic diagram of the lightemitting device according to this embodiment, and is a perspective viewof the whole light emitting device.

The light emitting device 1 includes a package 100, a light emittingelement 200, wires 250, and a second resin 300. The light emittingelement 200 is mounted on the second electrode 20 of the package 100.The shape and size of the light emitting element 200 used here are notparticularly limited. For the emission color of the light emittingelement 200, any wavelength can be selected in accordance with theapplications. For example, a nitride semiconductor can be used as thelight emitting element emitting blue light having a wavelength in arange between 430 and 490 nm. For the nitride semiconductor,In_(X)Al_(Y)Ga_(1-X-Y)N (0≤X≤1, 0≤Y≤1, X+Y≤1), or the like can be used.The light emitting device 1 may include a protective element, and theprotective element may be covered with a second resin 300.

The wires 250 are conductive wires for electrically connecting theelectronic components, such as the light emitting element 200 and theprotective element, with the first electrode 10 and the second electrode20. Examples of the materials used for the wires 250 include metals,such as gold, silver, copper, platinum, and aluminum, as well as theiralloys. Particularly, it is preferable to use gold which has goodthermal conductivity. The size of the wires 250 is not particularlylimited, and can suitably be selected in accordance with the objectivesand applications.

The second resin 300 covers the light emitting element 200 and the likethat are mounted on the package 100. The second resin 300 protects thelight emitting element 200 and the like from external forces, dust, andmoisture, as well as improving the heat resistance, weather resistanceand light resistance of the light emitting element 200 and the like.Examples of the materials for the second resin 300 include transparentmaterials, thermosetting resins, such as silicone resins, epoxy resins,and urea resins. In addition, these materials can contain a filler, suchas a phosphor, and a substance having a high light reflectance, in orderto have a prescribed function.

When mixed with a phosphor, for example, the second resin 300 canfacilitate the color tone adjustment for the light emitting device 1.Any phosphor which has a higher specific gravity than the second resin300, and absorbs and converts the wavelength of the light from the lightemitting element 200 can be used. The phosphor having a higher specificgravity than the second resin 300 is preferable, as it settles near thefirst electrode 10 and the second electrode 20.

Specific examples include yellow phosphors, such as Y₃Al₅O₁₂:Ce (YAG)and silicate, and red phosphors, such as CaAlSiN₃:Eu (CASN) andK₂SiF₆:Mn (KSF).

For the filler to be contained in the second resin 300, any substancehaving a high optical reflectance, for example, SiO₂, TiO₂, Al₂O₃, ZrO₂,and MgO can suitably be used. For the purpose of cutting an undesirablewavelength, organic or inorganic pigments and dyes, for example, can beused.

Method for Manufacturing the Light Emitting Device 1 First ManufacturingMethod

In the first method for manufacturing the light emitting device 1, alight emitting element 200 is mounted on the first electrode 10 or thesecond electrode 20 following step (5), but before step (6) of themethod for producing the package 100. In other words, the light emittingelement 200 is mounted on the first electrode 10 or the second electrode20 of the package 100 which has not been separated from the lead frame5.

The light emitting element 200 is of a single-sided electrode structurehaving a pair of n and p electrodes formed on the upper face. In thiscase, the back face of the light emitting element 200 is bonded onto thefirst electrode 10 using a die bonding material, one of the electrodeson the upper face is connected to the first electrode 10 using a wire250, and the other electrode on the upper face is connected to thesecond electrode 20 using a wire 250.

Then, the second resin 300 is applied to the recess surrounded by thewall portions 31 of the first resin 30 of the package 100 to seal thelight emitting element 200. At this point, the second resin 300 isdripped until it reaches the upper face of the recess of the first resin30. The recess of the first resin 30 can be filled with second resin 300by using methods, such as dripping, injection, compression, andextrusion. Filling by way of dripping is preferable because the airremaining in the recess of the first resin 30 can be effectivelyevacuated.

Second Method for Manufacturing the Light Emitting Device

In the first method for manufacturing the light emitting device 1, thelight emitting element 200 was mounted on the first electrode 10 or thesecond electrode 20 of the package 100 before separating the package. Inthe second manufacturing method, the light emitting element 200 may bemounted on the package 100 after the step of separating the package 100.In other words, the light emitting element 2 is mounted on the separatedpackage.

Variation 1

The lead frame 5 shown in FIG. 5 has a first opening 6 a and a secondopening 6 b provided on both sides of the first outer lead portion 11.Two injection ports may be provided for injecting the first resin 30through the two openings.

The upper die 550 of the molding dies 500 shown in FIG. 9 was explainedto have one injection port 555, but two injection ports can be formed onboth sides of the first electrode 10 through which the first resin 30can be injected.

Injection ports can also be provided at locations corresponding to oneor both sides of the second electrode 20 in addition to the locationnext to the first electrode 10 for injecting the first resin 30.

This can shorten the time for injecting the first resin 30. This alsoreduces the pressure applied when injecting the first resin 30.Injecting the first resin 30 from two injection ports and cutting andremoving the injection ports while providing wide flange portions 32 canbroaden the mounting face on the back face side, thereby improving themounting stability.

Variation 2

The shape of the lead frame 5 shown in FIG. 5 is one example, and thefirst electrode 10 and the second electrode 20 may be made equal insize, or have different shapes from one another.

A through hole may be provided in the lead frame 5 at the center of eachof the right and left short sides of the rectangular package formingarea 600 indicated by virtual lines in FIG. 5.

Example

An example will be explained below with reference to the packageaccording to this embodiment, but the invention is not limited to thisexample. The size of the example includes a tolerance of ±10%.

The size of the package 100 according to the example is about 2.2 mm inlength×about 1.4 mm in width×about 0.7 mm in height. The size includesthe first electrode 10 and the second electrode 20. The distance betweenthe outer lateral faces 31 a and 31 c of the opposing wall portions 31is about 2.0 mm, and the width of the outer lead portion 11 of the firstelectrode 10 and the outer lead portion 21 of the second electrode 20 isabout 0.1 mm from the wall portion 31. The larger width flange portion32 next to the first electrode 10 is 0.1 mm in width, while the smallerwidth flange portion 32 next to the first electrode 10 and the flangeportion 32 c next to the second electrode 20 are 0.05 mm in width. Thetips of the outer lead 11 of the first electrode 10 and the outer lead21 of the second electrode 20 extend about 0.05 mm from the tip of theflange portion 32 c. The depth of the first indentation 711 and thesecond indentation 721 is about 0.05 mm from the tips. The thickness ofthe first electrode 10 and the second electrode 20 is about 0.2 mm. Thedistances between inner lateral faces of the wall portions 31 are about1.65 mm in length×and about 1.1 mm, forming substantially a quadranglewith rounded corners.

Copper is used as the base material for the first electrode 10 and thesecond electrode 20, and the portions exposed from the first resin 30are silver plated. A polyamide resin containing a light reflectingmaterial is used for the first resin 30, and titanium oxide is used asthe light reflecting material. A silicone resin is used for the secondresin 300. Nitride semiconductor layers stacked on a sapphire substrateare used for the light emitting element 200. Wires containing gold as amajor component are used for the wires 250 for electrically connectingthe light emitting element 200 with the first electrode 10 and thesecond electrode 20.

The light emitting device according to the embodiment of the presentinvention can be utilized in lighting fixtures, automotive lightemitting devices, and the like.

Obviously, numerous modifications and variations of the presentinvention are possible in light of the above teachings. It is thereforeto be understood that within the scope of the appended claims, theinvention may be practiced otherwise than as specifically describedherein.

What is claimed is:
 1. A package comprising: a first electrode locatedat a bottom portion of a bottomed recess and having a first outer leadwhich has a first indentation at a tip in a plan view; a secondelectrode located at the bottom portion of the bottomed recess andhaving a second outer lead which has a second indentation at a tip in aplan view; and a first resin securing the first electrode and the secondelectrode in place and forming a part of the bottomed recess, whereinthe first resin has at least a portion between the first electrode andthe second electrode located at the bottom portion of the bottomedrecess, wall portions structuring lateral walls of the bottomed recess,and flange portions having the same thickness as a thickness of thefirst outer lead and different outward widths from the wall portions onboth sides of the first outer lead in a plan view.
 2. The packageaccording to claim 1, wherein in a plan view, one of the flange portionslocated on both sides of the first outer lead portion has substantiallythe same width as that of the first outer lead, and the other one of theflange portions located on both sides of the first outer lead portionhas smaller width than that of the first outer lead portion.
 3. Thepackage according to claim 1, wherein in a plan view, the bottomedrecess has a first outer lateral face, a second outer lateral facecontiguous with the first outer lateral face, a third outer lateral facecontiguous with the second outer lateral face and opposing the thirdouter lateral face, and a fourth outer lateral face contiguous with thefirst outer lateral face and the third outer lateral face, the firstouter lead portion is located at the first outer lateral face, and thesecond outer lead portion is located at the third outer lateral face. 4.The package according to claim 3, wherein the flange portion is locatedat least on one side of the second outer lead portion at the third outerlateral face.
 5. The package according to claim 3, wherein the flangeportion is also provided at the second outer lateral face and at thefourth outer lateral face.
 6. The package according to claim 3, whereinthe width of the flange portion at the second outer lateral face and thewidth of the flange portion at the fourth outer lateral face aresubstantially the same.
 7. The package according to claim 3, wherein thesecond outer lateral face and the fourth outer lateral face are composedonly with the first resin.
 8. The package according to claim 3, whereinthe width of the other one of the flange portions located on both sidesof the first outer lead portion is substantially the same as the widthof the flange portion located at the second outer lateral face.
 9. Thepackage according to claim 1, wherein the upper face, the lower face,and the lateral face of the first indentation, and one of the end facescontiguous with the first indentation of the first outer lead portionare covered by a metal, while the other end face contiguous with thefirst indentation is not covered by a metal.
 10. The package accordingto claim 1, wherein the thickness of the first resin between the firstelectrode and the second electrode is smaller than the thickness of thefirst electrode.
 11. The package according to claim 1, wherein in a backview, the first resin is inwardly depressed relative to the firstelectrode and the second electrode.
 12. A light emitting device having:the package according to claim 1, and a light emitting element mountedon at least one of the first electrode and the second electrode.
 13. Thelight emitting device according to claim 12, wherein the light emittingelement is covered with a second resin.
 14. The package according toclaim 1, wherein the first resin contains a light reflecting material.15. The package according to claim 1, wherein the first resin includes athermosetting resin.
 16. The package according to claim 1, wherein thefirst resin includes a thermoplastic resin.
 17. The light emittingdevice according to claim 13, wherein the second resin contains aphosphor.
 18. The light emitting device according to claim 13, whereinthe second resin includes a silicone resin.
 19. The light emittingdevice according to claim 13, wherein the second resin includes an epoxyresin.